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High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

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High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

Name: High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance
Brand: KAMTAI
Price: 1 USD

Brand Name : KAMTAI

Model Number : KTALP6-1

Certification : SGS

Place of Origin : CHINA

MOQ : 10PCS

Price : Negotiable

Payment Terms : L/C, T/T, Western Union, MoneyGram,PAYPAL

Supply Ability : 20000PCS/ MONTH

Delivery Time : 25 DAYS AFTER PAYMENT

Packaging Details : CARTON BOX AND PLYWOOD PALLET

Color : Ivory White

Name : High Thermal Conductivity Alumina Ceramic Substrate with High Heat Resistance

Bulk Density : 3.6g/cm3

Usage : Circuit Insulation

MOQ : 10PCS

Type : Ceramic plate

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High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

1. Description

Alumina ceramic is widely used in many fields. Because of its great performance, it is more and more used in curent society, alumina ceramic substrate can meet the requirement of daily using and specifical features.

Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double) at high temperature. The made of ultra-thin composite substrate with excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and the same as the PCB can be etched a variety of graphics, with a large current carrying ability. Therefore, the ceramic substrate has become the basis of high-power power electronic circuit structure technology and interconnect technology.

2. Main Features

1. Can be made into various of complex shapes, high dimension accuracy.

2. Contact with flame directly,no odor and volatile gases at high temperatures
3. High mechanical strength,resistance to gas flow.
4. Low shrinkage,low thermal conductivity.
5. Excellent strength in high temperature and thermal stability.

3. Specification

Item	Unit	95% Alumina ceramic	99% Alumina ceramic
Bulk density	g/cm3	>3.6	3.89
Max use temperature	℃	1500	1700
Water absorbtion	%	0	0
Bending Strength	Mpa	364	450
Expansion (25-800°C)	(X10-6/°C)	7.6	8
Thermal Conductivity	(W/(m.R))	20	35
Dielectric Strength	(kv/mm)	11	12

Application:

1. High Power Power Semiconductor Modules; Semiconductor Coolers, Electronic Heaters; Power Control Circuits, Power Hybrid Circuits.
2. Smart Power Components; High Frequency Switching Power Supply, Solid State Relays.
3.Automotive, Aerospace and Military Electronics Components.
4. Solar panel components; telecommunications switches, receiving systems; lasers and other industrial electronics.

High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance

Product Tags:

porous ceramic disc

alumina ceramic tube

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